DFR Reactor Operational Details

The Dual-Frequency Processor combines the synergistic effect of intense nearfield ultrasonic energy with our Dual-Frequency Processing Technology.

The nearfield sound field is located next to the sound source.
As the acoustic pressure wave travels through the liquid medium, the shock wave is dampened and the sound field intensity is reduced.  The farfield effect of dampened sound waves is widely used in ultrasonic cleaning and for low power processing installations.  The nearfield region is where the intense pressure waves violently act upon the process solution with dramatic results.


The nearfield processing region is where the intense sound shock waves are located.  The nearfield processing zone is the sound field found between the Diaphragm Plate and one acoustic wavelength away from this surface. The high-intensity shock waves within this region violently cavitate the processing solution.


The sound energy delivered to the process solution is amplified when the two opposing sound fields are placed close to one another.  This configuration maximizes the ultrasonic power to volume ratio within the reactor's reaction chamber.

The flow rate through the reactor is directly proportional to particle/process solution's dwell time within the ultrasonic reaction chamber.  The ultrasonic effect within the nearfield sound field is insensitive to flow rate disturbances.  Flow may be increased up to 3 feet/second without a significant reduction in acoustic performance, (ie. particle velocities < 1 m/s).  This is significant for processes which require a small gap between the diaphragm plates.


The sound density may be reduced by increasing the gap between the diaphragm plates.  The Dual-Frequency power amplification effect remains highly effective as the processing chamber's size increases.  The velocity of the process solution through the sound field will influence the reaction kinetics as the gap distance changes.

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July 27, 2006 Reactor Operational Details.htm